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IEEE Transactions on VLSI 2026

Following Novelty based Research Projects not yet Published in Any Journal 

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sale OFFER 38%
4-ASK Receiver Front-End
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Accessories, Low power VLSI Design, VLSI, VLSI 2026

A 25-Mb/s 4-ASK Receiver Front-End in 65-nm CMOS for Biomedical Data Telemetry via a Capacitive Link

₹16,000.00 Original price was: ₹16,000.00.₹10,000.00Current price is: ₹10,000.00.
Source : Tanner EDA From : IEEE Transaction on Circuit and System II : Express Brief : Vol. 73, No. 1, January 2026. Base paper abstract:

This brief presents a 25-Mbps 4-amplitude-shiftkeying (4-ASK) receiver front-end (RFE) for biomedical data telemetry via a series-resonant capacitive link. The RFE incorporates low-power clock and data recovery (CDR) circuitry for synchronization in which a novel highly linear trans conductance (Gm) cell is employed in the phase detector (PD) to mitigate any possible error decisions while comparing the phase difference between the input and feedback signals. The proposed RFE is fabricated in 65 nm 1P8M standard CMOS, the core circuit occupies 0.11 mm2, and consumes 2.9 mA from 1 V. While conducting ex vivo measurements using beef tissue and a series-resonant capacitive link, the proposed RFE is capable of processing 4-ASK data patterns up to 25 Mbps with bit error rate (BER) less than 10−3 and total jitter of ∼42 ns. Index Terms Amplitude-shift-keying (ASK), capacitive wireless data transfer (C–WDT), clock and data recovery (CDR), receiver front-end (RFE), series-resonant capacitive link.

List of the following  materials will be included with the Downloaded Backup:
1. Source code ( Modelsim/ Xilinx/ Quartus/ DSCH3/ Microwind)
2. Existing and Proposed Project Comparison with output video 
3. Basic Documentation (20 to 30 Pages):
3.1 Proposed Title
3.2 Proposed Abstract
3.3 Advantages & Disadvantages
3.4 Improvement of this Project
3.5 Existing System with Notes
3.6 Proposed System with Notes
3.7 Literature Survey
3.8 Software Related Notes
3.9 VLSI and HDL Language / Tanner Notes
3.10 References & Reference Paper for More Pages
4. Online Support ( Any Desk / Zoom / Google Meet)
 
sale OFFER 38%
High-Precision MAC
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Accessories, Low power VLSI Design, VLSI, VLSI 2026

A 9T SRAM Computation-in-Memory Architecture with High-Precision MAC

₹16,000.00 Original price was: ₹16,000.00.₹10,000.00Current price is: ₹10,000.00.
Source : Tanner EDA From : IEEE Transaction on VLSI System, VOL. 34, NO. 1, JANUARY 2026. Base paper abstract:

To address the data-intensive demands of modern artificial intelligence (AI) systems, computation-in-memory(CIM) based on static random-access memory (SRAM) has emerged as a promising solution by integrating computing functionality within memory arrays. However, conventional SRAM CIM architectures face two key limitations: low output resistance in single-transistor transmission paths and voltage instability on charge-sharing bitlines. These limitations collectively degrade computational accuracy to 4–5 LSB-level integral nonlinearity (INL), restricting practical deployment. This work proposes a regulated-cascode 9T SRAM cell that enhances analog computation accuracy using a high-impedance transmission path through a cascode configuration and stabilizing the discharge amount of the bitline from a single cell via active feedback regulation. Implemented in Semiconductor Manufacturing International Corporation (SMIC) 55-nm CMOS technology, the proposed cell demonstrates 1.31 LSB INL at 400-mV bitline swing (68.4% improvement versus 4–5 LSB baselines), achieving 66.7% voltage utilization efficiency compared with the conventional 50% limit and 23.04% frequency improvement is achieved compared with the conventional architecture. It also achieves an energy efficiency of 18.47 fJ/bit and a compact area of 2.655 × 1.175 µm, while demonstrating a classification accuracy of 97.7% on the MNIST dataset. Index Terms Analog linearity enhancement, multirow readout, regulated cascode circuits, static random-access memory (SRAM)-based compute-in-memory, voltage utilization efficiency.

List of the following  materials will be included with the Downloaded Backup:
1. Source code ( Modelsim/ Xilinx/ Quartus/ DSCH3/ Microwind)
2. Existing and Proposed Project Comparison with output video 
3. Basic Documentation (20 to 30 Pages):
3.1 Proposed Title
3.2 Proposed Abstract
3.3 Advantages & Disadvantages
3.4 Improvement of this Project
3.5 Existing System with Notes
3.6 Proposed System with Notes
3.7 Literature Survey
3.8 Software Related Notes
3.9 VLSI and HDL Language / Tanner Notes
3.10 References & Reference Paper for More Pages
4. Online Support ( Any Desk / Zoom / Google Meet)
 
sale OFFER 50%
Fractional Output Divider
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Accessories, Low power VLSI Design, VLSI, VLSI 2026

An Area-Efficient Fractional Output Divider Based on Foreground DTC INL Calibration

₹12,000.00 Original price was: ₹12,000.00.₹6,000.00Current price is: ₹6,000.00.
Source : Tanner EDA From : IEEE Transaction on VLSI System, VOL. 73, NO. 1, JANUARY 2026. Base paper abstract:

This brief presents a fractional output divider (FOD) with a foreground digital-to-time converter (DTC) INL calibration scheme. This calibration scheme adjusts the delay control words of two main DTCs (mDTCs) to enable mutual comparison between them. By using a sign-least-mean-squares (sign-LMS) algorithm, the INL error codes are obtained and subsequently applied to a calibration DTC (cDTC) to compensate for the mDTC INL. The prototype occupies a compact core area of 0.01mm2 and operates at a 0.9V supply with a power consumption of 3.6mW at 500MHz. Measurements demonstrate an integrated jitter of 512fs (10kHz to 20MHz) and spur level of -70dBc at 123.46MHz. Index Terms—Fractional output divider (FOD), frequency synthesis, digital-to-time converter (DTC), integral nonlinearity (INL), foreground calibration, bang-bang phase detector (BBPD).

List of the following  materials will be included with the Downloaded Backup:
1. Source code ( Modelsim/ Xilinx/ Quartus/ DSCH3/ Microwind)
2. Existing and Proposed Project Comparison with output video 
3. Basic Documentation (20 to 30 Pages):
3.1 Proposed Title
3.2 Proposed Abstract
3.3 Advantages & Disadvantages
3.4 Improvement of this Project
3.5 Existing System with Notes
3.6 Proposed System with Notes
3.7 Literature Survey
3.8 Software Related Notes
3.9 VLSI and HDL Language / Tanner Notes
3.10 References & Reference Paper for More Pages
4. Online Support ( Any Desk / Zoom / Google Meet)
 
IEEE Transactions on VLSI 2026, VLSI 2026 IEEE Project, VLSI Low Power 2026 Project, VLSI High Speed 2026 Project, VLSI Area Efficient 2026 Project, Low-Cost VLSI 2026 Projects, High-Speed VLSI Design 2026 projects (CDMA, RTOS, DSP, RF, IF, etc.), Low Power VLSI Design 2026 projects, Area Efficient VLSI Design 2026 projects, Audio processing VLSI Design 2026 projects, Signal Processing VLSI Design 2026 projects, Image Processing VLSI Design 2026 projects, Backend VLSI Design 2026 projects (CMOS, TFET, BisFET, FeFET, etc.), Timing & Delay Reduction VLSI 2026 Projects, Internet of Things VLSI 2026 Projects, Testing, Reliability and Fault Tolerance VLSI Projects, VLSI Applications (Communicational, Video, Security, Sensor Networks, etc.), SOC VLSI Projects, Network on Chip VLSI Projects, Wireless Communication VLSI Projects, VLSI Verifications Projects (UVM, OVM, VVM, System Verilog).

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