Power analysis (PA) attacks have become a serious threat to security systems by enabling secret data extraction through the analysis of the current consumed by the power supply of the system. Embedded memories, often implemented with six-transistor (6T) static random access memory (SRAM) cells, serve as a key component in many of these systems. However, conventional SRAM cells are prone to side-channel power analysis attacks due to the correlation between their current characteristics and written data. To provide resiliency to these types of attacks, we propose a security-oriented 7T SRAM cell, which incorporates an additional transistor to the original 6T SRAM implementation and a two-phase write operation, which significantly reduces the correlation between the stored data and the power consumption during write operations. The proposed 7T SRAM cell was implemented in a 28 nm technology and demonstrates over 1000× lower write energy standard deviation between write ‘1’ and ‘0’ operations compared to a conventional 6T SRAM. In addition, the proposed cell has a 39%–53% write energy reduction and a 19%–38% reduced write delay compared to other power analysis resistant SRAM cells.
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A non-destructive column-selection-enabled 10T SRAM for aggressive power reduction is presented in this brief. It frees a half-selected behavior by exploiting the bit line-shared data-aware write scheme. The differential-VDD (Diff-VDD) technique is adopted to improve the write ability of the design. In addition, its decoupled read bit lines are given permission to be charged and discharged depending on the stored data bits. In combination with the proposed dropped-VDD biasing, it achieves the significant power reduction. The experimental results show that the proposed design provides the 3.3× improvement in the write margin compared with the standard Diff-10T SRAM. A 5.5-kb 10T SRAM in a 65-nm CMOS process has a total power of 51.25 µW and a leakage power of 41.8 µW when operating at 6.25 MHz at 0.5 V, achieving 56.3% reduction in dynamic power and 32.1% reduction in leakage power compared with the previous single-ended 10T SRAM.
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In this paper, the performance boundaries and corresponding tradeoffs of a complex dual-mode class-C/D voltage controlled oscillator (VCO) are extended using a framework for the automatic sizing of radio frequency integrated circuit blocks, where an all-inclusive test bench formulation enhanced with an additional measurement processing system enables the optimization of “everything at once” toward its true optimal tradeoffs. VCOs embedded in the state-of-the-art multi standard transceivers must comply with extremely high performance and ultralow power requirements for modern cellular and Internet of Things applications. However, the proper analysis of the design tradeoffs is tedious and impractical, as a large amount of conflicting performance figures obtained from multiple modes, test benches, and/or analysis must be considered simultaneously. Here, the dual-mode design and optimization conducted provided 287 design solutions with figures of merit above 192 dBc/Hz, where the power consumption varies from 0.134 to 1.333 mW, the phase noise at 10 MHz from −133.89 to −142.51 dBc/Hz, and the frequency pushing from 2 to 500 MHz/V, on the worst case of the tuning range. These results pushed this circuit design to its performance limits on a 65-nm CMOS technology, reducing 49% of the power consumption of the original design while also showing its potential for ultralow power with more than 93% reduction. In addition, worst case corner criteria were also performed on the top of the worst case tuning range optimization, taking the problem to a human-untrea table LXVI-D performance space.
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